High Luminance & Heat Dissipation Technology
- With its wealth of heat dissipation designs, high luminosity, selection of heat dissipating materials, plating technology and other top-of-the-line offerings Satosen offers the ultimate in heat dissipation technology.
- High luminance technology has led to improved reflectance due to dedicated LED white substrates and solder resistance, helping to reduce color loss during implementation and use.
- Provides optimal surface treatment for luminance reflector processing and LED wavelengths.
- Provides a variety of heat dissipation measures aimed at lowering the chip’s junction temperature.
V cut, router and press processing are all possible for contouring work.
- Metal base (aluminum, copper) printed circuit board
- Heat dissipation CEM-3, heat dissipation FR-4, double-faced heat dissipation, heat dissipating multi-layer printed circuit board
- Heat dissipating metal-bonded printed circuit board
- Metal direct-bonded printed circuit board
- Heat dissipation is possible using a copper paste thermal via plug in the through hole.
- Heat sink pin-induced heat dissipation is possible by means of pin insertion to the through hole.